Multilayer wiring structure

Details Multilayer wiring structure Multilayer wiring structure

1994-03-11

1998-03-03

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257211, 257773, 257776, H01L 2348

Patent

active

057239088

ABSTRACT:
A multilayer wiring structure comprising a substrate, two line layers, and an interlayer insulating film. The first line layer consists of strip-shaped power/ground lines which extend parallel to one another. The second line layer is located above or below the first line layer, extends substantially parallel to the first line layer. The second line layer consists of strip-shaped signal lines which extend parallel to one another and at an angle to the strip-shaped power/ground lines of the first line layer in a skewed position.

REFERENCES:
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patent: 4924290 (1990-05-01), Enkaku et al.
patent: 5095352 (1992-03-01), Noda et al.
patent: 5103288 (1992-04-01), Sakamoto et al.
patent: 5119170 (1992-06-01), Iwamatsu
patent: 5136358 (1992-08-01), Sakai et al.
patent: 5148263 (1992-09-01), Hamai
patent: 5185650 (1993-02-01), Wakimoto et al.
patent: 5406118 (1995-04-01), Saito

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