Multilayer substrate

Details Multilayer substrate Multilayer substrate

2007-11-20

2007-11-20

Tran, Thien F (Department: 2811)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S737000

Reexamination Certificate

active

10845002

ABSTRACT:
A multilayer substrate device formed from a base substrate and alternating metalization layers and dielectric layers. Each layer is formed without firing. Vias may extend through one of the dielectric layers such that two metalization layers surrounding the dielectric layers make. contact with each other. The vias may be formed by placing pillars on top of a metalization layer, forming a dielectric layer on top of the metalization layer and surrounding the pillars, and removing the pillars. Dielectric layers may be followed by other dielectric layers and metalization layers may be followed by other metalization layers. Vias in the substrate may be filled by forming an assembly around the substrate, the assembly including printing sheets containing a conductive ink and pressure plates for applying pressure. A vacuum may be applied to remove air in the ink. Pressure may then be applied to the printing sheets through the pressure plates. The conductive ink in the printing sheets is pushed through the vias when pressure is applied by the pressure plates.

REFERENCES:
patent: 3296012 (1967-01-01), Stalnecker, Jr.
patent: 4976991 (1990-12-01), Ammende et al.
patent: 5112699 (1992-05-01), Chang
patent: 5231054 (1993-07-01), Kosugi
patent: 5693577 (1997-12-01), Krenik et al.
patent: 5795545 (1998-08-01), Koripella et al.
patent: 6060176 (2000-05-01), Semkow et al.
patent: 6081182 (2000-06-01), Tomozawa et al.
patent: 6197688 (2001-03-01), Simpson
patent: 6256206 (2001-07-01), Van Campenhout
patent: 6458686 (2002-10-01), Piao
patent: 2001/0048164 (2001-12-01), Tateoka et al.
patent: 2064126 (1981-06-01), None
patent: 02001074681 (1999-09-01), None
Dr. J. Prymak; Dr. S. Bhattacharya & Prof. K. Paik-Fundamentals of Passives: Discrete Integrated, and Embedded(CH.11)-Fundamentals of Microsystems Packaging, 2001.
T. Remmel; P. Zurcher; M. Kim; M. Miller; M. Raymond; S. Straub; M. Tarabbia; R. Steimle & P. Chu-Integration of Thin-Film Capacitors and Resistors into ULSI Technology for Wireless Applications-Passive Compnent Industry, Jan./Feb. 2001.
PCT International Search Report as issued in International Application No. PCT/US03/29224, Mailing date May 4, 2004.

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