Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-03-08
1993-05-04
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156655, 156656, 1566591, 156668, 156644, 156902, 29852, 29874, 428209, 428901, B44C 122, B29C 3700, C23F 100
Patent
active
052078655
ABSTRACT:
A multilayer structure is fabricated by forming a conductive layer on an insulative substrate. A first conductive pattern is formed on the first conductive layer and a resist layer having a via hole therethrough is formed on the first pattern. A via lead is formed in the via hole by electrically plating a metal therein utilizing the first layer as a lead for the plating process. The resist and the exposed part of the first layer ar removed and a polyimide layer having a thermal expansion coefficient that is equal to that of the via lead is formed over the substrate. The surface of the polyimide layer is etched until the via lead top segment protrudes to a predetermined height above the surface of the etched polyimide layer. A second pattern is formed on the polyimide layer and the exposed lead segment by a plating process.
REFERENCES:
patent: 4917759 (1990-04-01), Fisher et al.
patent: 4970106 (1990-11-01), Distefano et al.
patent: 4983250 (1991-01-01), Pan
6th IEEE/CHMT International Electronic Manufacturing Technology Symposium, Apr. 26, 1989, NARA, JP pp. 128-131; N. Iwasaki et al.: "A pillar-shaped via structure in a cu-polyimide multilayer substrate".
IBM Technical Disclosure Bulletin, vol. 20, No. 9, Feb. 1978, New York US, pp. 3443-3444; M. M. Haddad: "Selectively electroplating pad terminals on an MLC substrate."
IBM Technical Disclosure Bulletin, vol. 32, No. 6B, Nov. 1989, New York US, pp. 326-327; "Additive plating on chromium for circuitizing non-epoxy substrates."
Fujitsu Limited
Powell William A.
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