Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1989-05-04
1990-02-06
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156634, 156645, 156656, 156666, 156902, 156345, 29852, 427 97, C23F 102, B44C 122, C03C 1500, C03C 2506
Patent
active
048986364
ABSTRACT:
A method of registering a plurality of substrate boards in a laminated printed wiring panel to permit drilling for plated-through holes at centers of terminal areas, which have shifted from design locations during processing of the boards and panel, involves drilling of a small target pilot hole at a known location through a substrate board prior to etching of a printed wiring pattern thereon. A small disc of magnetically detectable material is inserted into the pilot target hole and a printed wiring pattern is then etched on the board. After etching of the drilled board, it is laminated with other printed wiring substrate boards to form a composite printed wiring panel. A magnetic detector using a transparent container with a small magnetic disc floated on the surface of a thin layer of water in the container is placed on a top surface of the board and moved to permit the magnetic disc to center over the embedded disc. The center coordinates of the magnetic disc are measured and an offset factor indicative of the shifted terminal area centers is determined. This shift factor is applied to all design drilling coordinates for drilling of the through-holes.
REFERENCES:
patent: 3562036 (1971-02-01), Travis
patent: 3649475 (1972-03-01), Degnan et al.
patent: 4631100 (1986-12-01), Pellegrino
Powell William A.
Wiggins Macdonald J.
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