Multilayer printed wiring boards

Details Multilayer printed wiring boards Multilayer printed wiring boards

1988-11-23

1990-05-22

Ryan, Patrick

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430313, 430315, 430319, 428901, 1566591, 1566611, 156668, 525109, 525121, G03C 500

Patent

active

049277421

ABSTRACT:
A multilayer printed wiring board is described having (1) an inner layer conductive pattern on an organic insulating base material, (2) a poly(vinyl acetal)-phenolic resin coating containing an amine substituted organic zirconate or titanate coupling agent, (3) a dielectric insulating layer, (4) a bonding composition capable of being adhesion promoted for electroless metal deposition comprising a phenolic resin having at least two methylol groups and substantially free of methyl ether groups, a heat resistant aromatic or cyclic resin having functional groups capable of reacting with the methylol groups without the evolution of water, and (5) an outer conductive pattern, the multilayer board being capable of withstanding at least five soldering cycles of at least 255.degree. C. for 2 seconds without blistering or delamination. Processes for manufacturing the multilayer board are also described.

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Eby, L. T. and Brown, H. P., in "Treatise on Adhesion and Adhesives," vol. 2, Patrick R. L. Ed., Copyright 1969, Marcel Dekkes, N.Y., pp. 129-141.
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