Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1995-06-05
1996-11-12
Caldarola, Glenn A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
1566281, 1566301, 427336, B32B 3112, B32B 3114
Patent
active
055736327
ABSTRACT:
In a multilayer printed-circuit substrate comprising a plurality of insulating resin layers, a plurality of metal-made electrically conductive circuits respectively laminated between the insulating resin layers and on the upper surface of the uppermost-positioned insulating resin layer and electrically conductive portions for respectively electrically connecting adjacent upper- and lower-positioned conductive circuits to each other, the insulating resin layers except at least the lowest-positioned insulating resin layer have flexibility, and blackening-treated films prepared by applying blackening treatment to the surface of the respective electrically conductive circuits are respectively provided between the upper surfaces of the conductive circuits and the insulating resin layers laminated thereon.
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Kumota Hidetaka
Shimamura Hiroshi
Shimizu Masakazu
Caldarola Glenn A.
Fuji 'Xerox Co., Ltd.
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