Multilayer printed circuit board

Details Multilayer printed circuit board Multilayer printed circuit board

1978-12-28

1981-02-10

Lesmes, George F.

Metal working

Method of mechanical manufacture

Electrical device making

29852, 156625, 156901, 339 17B, 339 17M, 361414, 427 97, 428901, 428138, H05K 112, H05K 114

Patent

active

042493021

ABSTRACT:
A multilayer printed circuit board having a pad pattern formed on each of the layers. When the board is assembled, the layers are releasably secured together. The pads on each layer are aligned and make electrical contact with the pads on adjacent layers to provide interlayer electrical connections.

REFERENCES:
patent: 3028573 (1962-04-01), Stoehr
patent: 3157857 (1964-11-01), Stapper et al.
patent: 3323198 (1967-06-01), Shortes
patent: 3436819 (1969-04-01), Lunine
patent: 3541222 (1970-11-01), Parks et al.
patent: 3780352 (1973-12-01), Redwanz
patent: 3880486 (1975-04-01), Avakian
patent: 3904934 (1975-09-01), Martin
patent: 3971610 (1976-07-01), Buchoff et al.
Webster's New World Dictionary, definition of "engage", p. 463, 2nd Edition, 1972.

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