Multilayer photoresist process utilizing an absorbant dye

Details Multilayer photoresist process utilizing an absorbant dye Multilayer photoresist process utilizing an absorbant dye

1981-03-30

1983-01-25

Downey, Mary F.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430313, 430316, 430396, G03C 500

Patent

active

043704050

ABSTRACT:
An improved photoetch technique is presented of the multilayer resist type wherein a thin top layer of resist and a thick planarizing layer are deposited on a substrate and the thin layer is exposed and developed to produce a patterned resist layer. The improvement involves dissolving a suitable dye in a layer between the thin top layer and the substrate. The dye is preferably selected to absorb light of the wavelengths used to expose the top layer but does not interfere with processing of the other layers.

REFERENCES:
patent: 1655127 (1928-01-01), Beebe
patent: 3751248 (1973-08-01), Goell
patent: 4102683 (1978-07-01), Di Piazza
patent: 4126466 (1978-11-01), Roos
patent: 4259433 (1981-03-01), Mizobuchi et al.

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