Multilayer interconnection board and production method thereof

Details Multilayer interconnection board and production method thereof Multilayer interconnection board and production method thereof

2007-02-27

2007-02-27

Lindsay, Jr., Walter (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S618000, C438S660000, C438S665000, C438S652000, C438S689000, C438S624000, C257S758000, C257S760000, C257S295000, C257SE21575, C257SE21585

Reexamination Certificate

active

11026971

ABSTRACT:
A multilayer interconnection board is disclosed that allows reliable electrical connection between an interconnection having a large width and a large area and a via provided in a via hole formed by pressing a tool against resin. A projecting portion for electrical connection is formed integrally with the insulating member and in a second interconnection groove having a width and an area greater than those of a first interconnection groove. While a first interconnection is being deposited in the first interconnection groove and a second interconnection is being deposited in the second interconnection groove, the projecting portion is formed in the second interconnection groove and a metal plating film is provided on the projecting portion at the same time, so as to electrically connect the second interconnection with the via.

REFERENCES:
patent: 6783652 (2004-08-01), Iijima et al.
patent: 2004/0056289 (2004-03-01), Ooishi
patent: 2004/0188843 (2004-09-01), Wakayama et al.

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