Multilayer high vertical aspect ratio thin film structures

Details Multilayer high vertical aspect ratio thin film structures Multilayer high vertical aspect ratio thin film structures

1995-06-07

1997-07-08

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566571, 216 2, 216 67, 437228H, 437927, 148 332, 148 334, H01L 2100

Patent

active

056456840

ABSTRACT:
This invention relates to the area of microelectromechanical systems in which electronic circuits and mechanical devices are integrated on the same silicon chip. The method taught herein allows the fabrication of thin film structures in excess of 150 microns in height using thin film deposition processes. Wafers may be employed as reusable molds for efficient production of such structures. Various material properties may be varied within the structures to produce electrical, mechanical or electromechanical devices.

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W. Lang et al., "Application of Porous Silicon as a Sacrificial Layer," 7th International Conference on Solid-State Sensors and Actuators Digest of Technical Papers, Jun. 7-10, 1993, pp. 202-205.

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