Multilayer electronic component, electronic device, and...

Details Multilayer electronic component, electronic device, and... Multilayer electronic component, electronic device, and...

2011-03-08

2011-03-08

Zarneke, David A (Department: 2891)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C257S693000, C257S697000

Reexamination Certificate

active

07903426

ABSTRACT:
A multilayer electronic component including a resin layer disposed on a mounting board side is mounted on a mounting board, and has a structure such that, even when deformation, such as deflection and strain, occurs, a stress on the multilayer electronic component is relieved. In the multilayer electronic component, ends of columnar conductors protrude from a main surface of a resin layer facing the outside. The multilayer electronic component is mounted on a mounting board, and the ends of the columnar conductors are electrically connected to conductive lands. In this case, a predetermined gap is formed between the multilayer electronic component and the mounting board.

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Official Communication issued in corresponding European Patent Application No. 06811611.0, mailed on Nov. 26, 2009.

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