Multilayer circuit boards

Details Multilayer circuit boards Multilayer circuit boards

1979-10-26

1982-01-26

Kucia, Richard R.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

174152GM, 361414, H05K 103

Patent

active

043130267

ABSTRACT:
A multilayer circuit board (10) for putting semiconductor devices thereon consists of conductor layers (6, 60, 61, 62, 63) made of a metal selected from the group consisting of Au, Ag, Cu and an alloy thereof, insulating material (2, 7) made of glass-ceramic and an alumina sintered plate (1). The glass-ceramic is comprised of borosilicate glass and alumina and has a low dielectric constant and a thermal expansion coefficient approaching that of the semiconductor devices. The alumina sintered plate (1) is placed between the ground and supply voltage conductor layers (62, 63) and the signal conductor layers (60).

REFERENCES:
patent: 2885826 (1959-05-01), Grieve et al.
patent: 3200298 (1965-08-01), Garibotti
patent: 3312870 (1967-04-01), Rhoades
patent: 3423517 (1969-01-01), Arrhenius
patent: 3723176 (1973-03-01), Theobald et al.
patent: 4047132 (1977-09-01), Kratjewski
Grubb, H. R., "Densely-Packaged Magnetic Film Memory", IBM Tech. Disc. Bull., vol. 14, No. 4, Sep. 1971, p. 1145.

Affiliated with

Also associated with

Rating

Multilayer circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer circuit boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1667793