Multilayer circuit board manufacturing

Details Multilayer circuit board manufacturing Multilayer circuit board manufacturing

1985-08-12

1987-02-10

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29852, 156633, 156634, 156644, 156652, 156655, 156656, 1566591, 156668, 156902, 427 97, 430314, 430318, C23F 102, B44C 122, C03C 1500, B29C 1708

Patent

active

046421602

ABSTRACT:
A circuit board is manufactured from a core layer having a conductor run layer overlying the core layer on one side thereof, and a continuous layer of dielectric material overlying the conductor run layer, by forming a continuous outer layer of conductive material over the layer of dielectric material. Material of the continuous outer layer is removed at a predetermined location, and the dielectric material that is thus exposed is also removed so as to form an opening through which the conductor run layer is exposed. Conductive material is deposited into the opening to at least the level of the outer conductor layer, whereby the conductor run layer is connected to the outer layer of conductive material.

REFERENCES:
patent: 4030190 (1977-06-01), Vorker
patent: 4211603 (1980-07-01), Reed
patent: 4566186 (1986-01-01), Bauer et al.

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