Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1985-03-04
1986-12-09
Kittle, John E.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430286, 430287, 430288, 522100, 522102, 522103, 526333, 526273, 525149, 525524, 525922, G03C 168, C08F 800
Patent
active
046280227
ABSTRACT:
Printed circuit boards having a plurality of circuit layers are produced on a copper-clad substrate by first forming a pattern in a desired configuration to produce the first layer of the printed circuit board, then covering it with an energy-sensitive material comprising a rubber modified epoxy resin, an acrylated epoxy resin and a viscosity modifier; the energy-sensitive material is delineated in a desired pattern and developed to uncover portions of the underlying metallization pattern and the entire substrate is then blanket cured to produce a rigid layer having openings in appropriate places; the openings are metallized and a second copper pattern is produced on the cured polymer by conventional metallization and lithographic techniques. If desired, the process is repeated until a suitable number of copper patterned levels are obtained.
REFERENCES:
patent: 3934335 (1976-01-01), Nelson
patent: 4033840 (1977-07-01), Fujiwara et al.
patent: 4054479 (1977-10-01), Peiffer
patent: 4090936 (1978-05-01), Barton
patent: 4103102 (1978-07-01), Klein
patent: 4115185 (1978-09-01), Carlson et al.
patent: 4121007 (1978-10-01), Kobayashi et al.
patent: 4130424 (1978-12-01), Feit et al.
patent: 4137081 (1979-01-01), Pohl
patent: 4169732 (1979-10-01), Shipley
patent: 4171974 (1979-10-01), Golda et al.
patent: 4250007 (1981-02-01), Yasuno et al.
patent: 4299893 (1981-11-01), Pigeon et al.
patent: 4442302 (1984-04-01), Pohl
Ors Jose A.
Small, Jr. Richard D.
AT&T - Technologies, Inc.
Hamilton Cynthia
Kittle John E.
Spivak J. F.
LandOfFree
Multilayer circuit board fabrication process and polymer insulat does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multilayer circuit board fabrication process and polymer insulat, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer circuit board fabrication process and polymer insulat will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1385318