Multilayer circuit board fabrication process

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

430313, 430324, 430328, 430330, G03C 500

Patent

active

047956933

ABSTRACT:
Printed circuit boards having a plurality of circuit layers are produced on a copper-clad substrate by first forming a pattern in a desired configuration to produce the first layer of the printed circuit board, then covering it with an energy-sensitive material comprising a rubber modified epoxy resin, an acrylated epoxy resin and a viscosity modifier; the energy-sensitive material is delineated in a desired pattern and developed to uncover portions of the underlying metallization pattern and the entire substrate is then blanket cured to produce a rigid layer having openings in appropriate places; the openings are metallized and a second copper pattern is produced on the cured polymer by conventional metallization and lithographic techniques. If desired, the process is repeated until a suitable number of copper patterned levels are obtained.

REFERENCES:
patent: 3934335 (1976-01-01), Nelson
patent: 4033840 (1977-07-01), Fujiwara et al.
patent: 4054479 (1977-10-01), Peiffer
patent: 4090936 (1978-05-01), Barton
patent: 4103102 (1978-07-01), Klein
patent: 4115185 (1978-09-01), Carlson et al.
patent: 4121007 (1978-10-01), Kobayashi et al.
patent: 4130424 (1978-12-01), Feit et al.
patent: 4137081 (1979-01-01), Pohl
patent: 4168732 (1979-10-01), Shipley
patent: 4171974 (1979-10-01), Golda et al.
patent: 4250007 (1981-02-01), Yasuno et al.
patent: 4299893 (1981-11-01), Pigeon et al.
patent: 4442302 (1984-04-01), Pohl
E. E. Schroeder, "Rubber", pp. 281-310, Chapter 9, in Riegel's Handbook of ndustrial Chemistry, eighth ed, edited by James E. Kent (Van Nostrand Reinhold Co., New York, N.Y., 1983).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multilayer circuit board fabrication process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer circuit board fabrication process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer circuit board fabrication process will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2168048

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.