Multilayer circuit board construction and method

Details Multilayer circuit board construction and method Multilayer circuit board construction and method

1978-05-01

1980-07-08

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29852, 156656, 156902, 174 685, 427 97, 428901, 430319, C23F 102

Patent

active

042116031

ABSTRACT:
Multilayer circuit boards having large area through-hole electrical connections are provided by a process that begins with the fabrication by known means of a drilled and through-hole plated single layer board. Next, a layer of insulating material is applied to either side of the board, leaving at least the through-hole plating exposed. A continuous layer of metal is then deposited on the body, completely covering the insulating layer and through-hole plating. Finally, the deposited metal layer is selectively masked and etched to form conductive circuit patterns on the insulating layer, overlying the original circuit patterns and electrically connected to them by the multiple layer through-hole plating.

REFERENCES:
patent: 3317408 (1967-05-01), Barnes et al.
patent: 3322881 (1967-05-01), Schneble et al.
patent: 3934335 (1976-01-01), Nelson

Affiliated with

Also associated with

Rating

Multilayer circuit board construction and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer circuit board construction and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer circuit board construction and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-559318