Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Reexamination Certificate
2011-08-02
2011-08-02
Thomas, Eric (Department: 2835)
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
C361S310000, C361S321200
Reexamination Certificate
active
07990677
ABSTRACT:
A multilayer chip capacitor includes: a capacitor body having first and second side surfaces and a bottom surface; a plurality of first and second internal electrodes in the capacitor body; first and second external electrodes having a first polarity and formed on the first and second side surfaces, respectively, to cover a respective lower edge of the side surfaces and to partially extend to the bottom surface; and a third external electrode having a second polarity and formed on the bottom surface. The internal electrodes are disposed in perpendicular to the bottom surface. Each of the first internal electrodes has a first lead drawn to the first side and bottom surfaces and a second lead drawn to the second side and bottom surfaces. Each of the second internal electrodes has a third lead drawn to the bottom surface.
REFERENCES:
patent: 4590537 (1986-05-01), Sakamoto
patent: 5880925 (1999-03-01), Dupre et al.
patent: 6433995 (2002-08-01), Nakagawa et al.
patent: 6768630 (2004-07-01), Togashi
patent: 7230815 (2007-06-01), Yoon et al.
patent: 2004/0223290 (2004-11-01), Sutardja
patent: 2005/0030510 (2005-02-01), Tsuji
patent: 2006/0279903 (2006-12-01), Togashi et al.
patent: 2008/0253059 (2008-10-01), Eggerding et al.
patent: 55-43869 (1980-03-01), None
patent: 02159710 (1990-06-01), None
patent: 06-053075 (1994-02-01), None
patent: 06033075 (1994-02-01), None
patent: 06251981 (1994-09-01), None
patent: 06325977 (1994-11-01), None
patent: 2001-155952 (2001-06-01), None
patent: 2004-140183 (2004-05-01), None
patent: 2004-296940 (2004-10-01), None
patent: 2006-013379 (2006-01-01), None
patent: 2006-100682 (2006-04-01), None
patent: 10-2006-0073274 (2006-06-01), None
Japanese Office Action, with English Translation, issued in Japanese Patent Application No. 2007-322638, dated Jan. 5, 2010.
United States Notice of Allowance issued in U.S. Appl. No. 11/987,835, mailed Nov. 29, 2010.
Chung Hae Suk
Lee Byoung Hwa
Park Dong Seok
Park Min Cheol
Park Sang Soo
McDermott Will & Emery LLP
Samsung Electro-Mechanics Co. Ltd.
Sinclair David M
Thomas Eric
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