Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-03-01
2005-03-01
Chambliss, Alonzo (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S701000, C257S758000, C438S611000, C438S623000, C438S670000
Reexamination Certificate
active
06861744
ABSTRACT:
A multilayer ceramic substrate has a first conductive pattern that is transfer-printed on a ceramic substrate using an intaglio plate made of a flexible resin. The intaglio plate has a plurality of grooves with different depts. A first insulation layer is on the first conductive pattern, and a second conductive pattern is on the insulating layer. The two conductive patterns are coupled by a via.
REFERENCES:
patent: 5106461 (1992-04-01), Volfson et al.
patent: 5162240 (1992-11-01), Saitou et al.
patent: 5413839 (1995-05-01), Chatwin et al.
patent: 5488542 (1996-01-01), Ito
patent: 5524784 (1996-06-01), Shiba et al.
patent: 5609704 (1997-03-01), Hayama et al.
patent: 5627406 (1997-05-01), Pace
patent: 5643831 (1997-07-01), Ochiai et al.
patent: 5866441 (1999-02-01), Pace
patent: 5892273 (1999-04-01), Iwasaki et al.
patent: 5926694 (1999-07-01), Chigawa et al.
patent: 5962925 (1999-10-01), Eifuku et al.
patent: 6027995 (2000-02-01), Chiang et al.
patent: 6051448 (2000-04-01), Hayama et al.
patent: 6075710 (2000-06-01), Lau
patent: 6100177 (2000-08-01), Noguchi
patent: 6123863 (2000-09-01), Shimomura et al.
patent: 6132543 (2000-10-01), Mohri et al.
patent: 6172422 (2001-01-01), Chigawa et al.
patent: 6249114 (2001-06-01), Sakai
patent: 6310304 (2001-10-01), Hayama et al.
patent: 6347584 (2002-02-01), Kawamoto et al.
patent: 6374733 (2002-04-01), Hayama et al.
patent: 6378424 (2002-04-01), Hayama et al.
patent: 4-221674 (1992-08-01), None
patent: 4-240792 (1992-08-01), None
patent: 6-267963 (1994-09-01), None
patent: 7-169635 (1995-07-01), None
patent: 8-273537 (1996-10-01), None
patent: 9-330843 (1997-12-01), None
patent: 10-242324 (1998-09-01), None
patent: 10-256425 (1998-09-01), None
patent: 11-121645 (1999-04-01), None
patent: 2000 200729 (2000-07-01), None
patent: 2000-353761 (2000-12-01), None
Hayama Masaaki
Matsunaga Hayami
Mouri Noboru
Chambliss Alonzo
Matsushita Electric - Industrial Co., Ltd.
RatnerPrestia
LandOfFree
Multilayer ceramic substrate utilizing an intaglio plate... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multilayer ceramic substrate utilizing an intaglio plate..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer ceramic substrate utilizing an intaglio plate... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3381298