Multichip package test

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C714S724000

Reexamination Certificate

active

06943577

ABSTRACT:
A test apparatus for testing a multi-chip package comprising a multiplicity of semiconductor chips, which includes a test driver having one drive channel and at least one input/output channel. A test board is mounted with the multi-chip package. Drive pins of the semiconductor chips are parallel connected to the drive channel, and input/output pins of the semiconductor chips are parallel connected to the input/output channel.

REFERENCES:
patent: 4467400 (1984-08-01), Stopper
patent: 4961053 (1990-10-01), Krug
patent: 5070297 (1991-12-01), Kwon et al.
patent: 5389556 (1995-02-01), Rostoker et al.
patent: 5399505 (1995-03-01), Dasse et al.
patent: 5701666 (1997-12-01), DeHaven et al.
patent: 09-311161 (1997-12-01), None
patent: 2001-0104719 (2001-11-01), None
English language abstract of Japnese Publication No. 09-311161, Dec. 1997.
English language abstract of Korean Publication No. 2001-0104719, Nov. 2001.

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