Multichip module package and fabrication method

Details Multichip module package and fabrication method Multichip module package and fabrication method

2005-07-12

2008-11-04

Pham, Hoai V (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S122000, C257SE21499

Reexamination Certificate

active

07445955

ABSTRACT:
A method for fabricating a multichip module package includes providing a first heat sink positioned for releasing heat from the package and providing a second heat sink positioned proximate the first heat sink. The heat sinks are thermally coupled and electrically isolated to and from one another. A first semiconductor device is attached to the first heat sink in thermal and electrical communication therewith and electrically insulated from the second heat sink. A second semiconductor device is attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink.

REFERENCES:
patent: 5396403 (1995-03-01), Patel
patent: 2004/0212071 (2004-10-01), Moshayedi

Affiliated with

Also associated with

Rating

Multichip module package and fabrication method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multichip module package and fabrication method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multichip module package and fabrication method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4021718