Multichip-module having an HDI and a temporary supporting substr

Details Multichip-module having an HDI and a temporary supporting substr Multichip-module having an HDI and a temporary supporting substr

1996-01-29

1997-08-05

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257723, 257668, 257700, 257774, 257758, H01L 2348, H01L 2352

Patent

active

056545908

ABSTRACT:
A multichip-module fabrication method includes the step of forming a chip-mounting substrate by forming a bonding layer on a supporting base and by forming one or a plurality of interconnection layers in a stack formation on the bonding layer via insulating layers. This method also includes the step of forming one or a plurality of throughholes extending through the insulating layers to the bonding layer on the chip-mounting substrate. Subsequently, this method separates the supporting base from the chip-mounting substrate by leading a treatment medium which is capable of removing the bonding layer to the bonding layer at least through one or a plurality of the throughholes. Finally, by mounting a semiconductor chip on the chip-mounting substrate, the multichip-module fabrication method is completed.

REFERENCES:
patent: 5192716 (1993-03-01), Jacobs

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