Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-03-06
1998-07-07
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257713, 361719, H05K 720
Patent
active
057778477
ABSTRACT:
A multichip module comprises a substrate mounting a plurality of circuit chips, a cover plate positioned over the circuit chips, and at least one pillar member for fixing the cover plate to the substrate to support it. The substrate has a plurality of circuit chips fixed in a predetermined pattern of locations on a side thereof. At least one pillar member fixes the cover plate to the substrate such that the cover plate is positioned over the circuit chips. Since the pillar member is fixed to the substrate at a small area to support the cover plate, the substrate can be prevented from deforming due to a temperature change. In order to secure the covering member, the pillar member is preferably fixed by means of an adhesive, a fit, or screwing.
REFERENCES:
patent: 4658331 (1987-04-01), Berg
patent: 4673772 (1987-06-01), Satoh
patent: 4914551 (1990-04-01), Anschel
patent: 5065273 (1991-11-01), Rajeevakumar
patent: 5305185 (1994-04-01), Samarov
patent: 5396403 (1995-03-01), Patel
patent: 5463529 (1995-10-01), Chia
patent: 5483098 (1996-01-01), Joiner, Jr.
patent: 5504653 (1996-04-01), Murphy
patent: 5510956 (1996-04-01), Suzuki
patent: 5533256 (1996-07-01), Call
Semiconductor--Cooling, Berndlmaier, IBM Tech Discl Bull vol. 20 No. 9 Feb. 1978 p. 3452
Dohya Akihiro
Tokuno Kenichi
NEC Corporation
Tolin Gerald P.
LandOfFree
Multichip module having a cover wtih support pillar does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multichip module having a cover wtih support pillar, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multichip module having a cover wtih support pillar will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1212923