Multichip module assembly having via contacts and method of maki

Details Multichip module assembly having via contacts and method of maki Multichip module assembly having via contacts and method of maki

1997-01-24

1999-07-06

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257779, 257783, 257784, 257723, 257698, 174261, 174260, 361792, 361760, 361767, 29832, H01Z 2316, H05K 334, H01L 2302

Patent

active

059201231

ABSTRACT:
A multichip module includes a printed circuit printed circuit board onto which traces of electrically conductive material are formed and into which groups of plated vias are formed. Each group of vias is associated with an integrated circuit to be mounted in the assembly and has a spacing pattern that is identical to the spacing pattern of the bond pads of the integrated circuit with which it is associated. A layer of insulative adhesive material is provided, one side of which is attached to the printed circuit board. A plurality of integrated circuits are attached to the other side of the adhesive material. Each of the integrated circuits has a plurality of bond pads in a spacing pattern. A conductive contact is disposed in each via to connect a bond pad to that via.

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