Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate
2011-07-12
2011-07-12
Cao, Phat X (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With heat sink means
C257S724000
Reexamination Certificate
active
07977776
ABSTRACT:
A multichip discrete package with a leadframe having a plurality of leads and a first die attach pad (DAP), the first DAP having side portions that extend above the first DAP, a first discrete die bonded to the first DAP, at least a first wirebond which forms an electrical connections between the first discrete die and a first selected one of the plurality of leads, a metal plate attached to tops of the side portions forming a second DAP, a second discrete die bonded to the second DAP, at least a second wirebond which forms an electrical connections between the second discrete die and a second selected one of the leads; and encapsulating material formed around the first and second die and the first and second DAPs.
REFERENCES:
patent: 5049973 (1991-09-01), Satriano et al.
patent: 5289344 (1994-02-01), Gagnon et al.
patent: 2009/0091010 (2009-04-01), Calo et al.
Alabin Leocadio Morona
Galera Manolito Fabres
Cao Phat X
Fairchild Semiconductor Corporation
FitzGerald Esq. Thomas R.
Hiscock & Barclay LLP
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