Multichip discrete package

Details Multichip discrete package Multichip discrete package

2011-07-12

2011-07-12

Cao, Phat X (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S724000

Reexamination Certificate

active

07977776

ABSTRACT:
A multichip discrete package with a leadframe having a plurality of leads and a first die attach pad (DAP), the first DAP having side portions that extend above the first DAP, a first discrete die bonded to the first DAP, at least a first wirebond which forms an electrical connections between the first discrete die and a first selected one of the plurality of leads, a metal plate attached to tops of the side portions forming a second DAP, a second discrete die bonded to the second DAP, at least a second wirebond which forms an electrical connections between the second discrete die and a second selected one of the leads; and encapsulating material formed around the first and second die and the first and second DAPs.

REFERENCES:
patent: 5049973 (1991-09-01), Satriano et al.
patent: 5289344 (1994-02-01), Gagnon et al.
patent: 2009/0091010 (2009-04-01), Calo et al.

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