Multi-zone method for controlling voc and nox emissions in a fla

Details Multi-zone method for controlling voc and nox emissions in a fla Multi-zone method for controlling voc and nox emissions in a fla

1996-06-10

1998-05-12

Bennett, Henry A.

Drying and gas or vapor contact with solids

Process

Gas or vapor contact with treated material

34509, 34500, F26B 300

Patent

active

057491607

ABSTRACT:
Environmental enhancement by controlling volatile organic compound (VOC) and NO.sub.x emissions in a flatline wafer drying system. The method is characterized by advancing the wafers of the type used in manufacture of oriented strand board (OSB) on a flatline conveyor embodying a plurality of dryer zones. Particularly, heating the dryer zones in successive lower temperatures in the range 500.degree. F. to 200.degree. F. by flowing heated air upwardly through the flatline wafer drying conveyor; removing VOC-rich exhaust air from a primary dryer zone while flowing heated air upwardly therein and removing VOC-rich exhaust air from a secondary dryer zone while flowing heated air from therein.

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patent: 5215670 (1993-06-01), Girovich
patent: 5341580 (1994-08-01), Teal
patent: 5524361 (1996-06-01), Dexter et al.

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