Multi-tool control system, method and medium

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

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Details

C700S100000, C700S108000, C700S116000, C438S011000

Reexamination Certificate

active

06640151

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to the control of tools and the communication among tools in a multi-tool semiconductor processing environment. More specifically, embodiments of the present invention relate to a system, method and medium for control of and communication among wafer processing tools in a wafer processing environment.
2. Related Art
In today's semiconductor manufacturing environment, a facility for the production of semiconductor products (such as, e.g., wafers) will typically contain multiple tools, each for performing one or more of a variety of functions. Thus, where a wafer is being processed into items such as logic (e.g., central processing units) or memory (e.g., DRAMs) units, each tool performs some specified function on the wafer, and then the wafer is passed on to the next tool. (The final product output, i.e., final state of the wafer, in this example, eventually gets cut up into individual chips, e.g., Central Processing Units, DRAM's, etc.)
An example of a conventional semiconductor manufacturing facility is now described with regard to FIG.
1
. Referring now to
FIG. 1
, a host computer
104
is shown as being in communication and control of the various aspects of the semiconductor manufacturing facility. More specifically, host computer
104
is in communication with Tools
1
-
3
(
112
-
116
, respectively) used to process (or inspect) semiconductor products. Thus, for example, Tool
1
(
112
) might be a deposition tool, while Tool
2
(
114
) might be a chemical mechanical polishing (CMP) tool.
For each tool shown in
FIG. 1
, there exists an associated station controller (
106
-
110
). These station controllers are used to facilitate the communication between the tools (
112
-
116
) and the host computer
104
. Since the tools often have disparate protocols, it becomes necessary to implement the station controllers (
106
-
110
) to allow the tools to communicate using protocol common to the semiconductor processing facility, and thus communicate with the host computer
104
. Such common protocols that may be used to ultimately communicate with the host computer
104
include SECS/GEM and HSMS.
In addition, host computer
104
is also in communication with a material transport control
102
, which controls an external material transport system
118
. The external material transport system
118
is what physically transports the semiconductor products (at their various stages of production) from one tool to another. (Typically, the semiconductor products are contained in cassettes, boxes or pods of 25 units.) Consequently, a semiconductor “tool” can be defined as a device that performs a given function or functions on a given semiconductor product (e.g., a wafer), whereby some external material transport system is required to transport the semiconductor product to and from the tool (and, thus, from and to other tools).
Various deficiencies have been found to exist using the conventional semiconductor factory scheme as described above. These deficiencies typically relate to the problems associated with communication and control of the tools, and can have effects on both the quantity and quality of the final (and intermediate) semiconductor products. Some of these deficiencies are described below.
Conventional semiconductor processing facilities contain tools whose individual output (in terms of quantity and/or quality) is controllable, and can be set to some amount/specification for a given tool. However, each tool is just one part of the overall wafer production process. Furthermore, the output of a given tool typically results in at least some variation from wafer to wafer. Consequently, in order to accurately control the quality and quantity of the final output resulting from the work of multiple tools, it would be desirable to effectively coordinate the efforts of the multiple tools by, e.g., facilitating enhanced communication to and between tools. This would more readily facilitate, for example, 1) allowing a tool to send information forward to a second tool to compensate for the variations in the output (in terms of quantity and/or quality) of the previous tool, and/or 2) allowing a tool to notify a previous tool of a variation so that the previous tool can compensate by modifying its procedures for the benefit of subsequently-processed products. However, protocols (which are currently very host-centric) do not currently exist to readily facilitate communication among tools. Consequently, what is needed is a scheme to facilitate communication between two or more tools so that the final product output from a combination of tools can be more accurately controlled, adjusted and predicted.
Another problem with conventional semiconductor processing facilities relates to the modification of recipes for particular semiconductor products being processed in the semiconductor processing facility. (A “recipe” is a sequence of steps that one or more semiconductor products are directed to go through within a given tool and/or series of tools.). Conventionally, if a recipe needs to be modified for a particular purpose (e.g., one or more individual semiconductor products needs to be specially treated), the entire recipe would become corrupt (e.g., the recipe would be changed and also there is no tracking or recording of the modifications made to the recipe for the individual semiconductor products. Consequently, what is needed is a scheme to systematically implement, track and record modifications made to an initial recipe for particular individual semiconductor products (e.g., such as semiconductor wafers) without corrupting the entire recipe.
Another deficiency with conventional schemes relates to determining whether a tool or set of tools, capable of producing a number of different products, and capable of implementing a number of different steps, is prepared to produce a particular semiconductor product that has been requested by the semiconductor processing facility (e.g., requested by the host computer
104
), and/or is prepared to implement required/requested step(s). Here, examples of the different products are particular types of central processing units. Knowledge of such information is clearly important so that proper planning can be undertaken before materials are sent to the various appropriate tools in the semiconductor processing facility. Consequently, what is needed is a scheme for determining whether a tool or series of tools are ready for the production of a particular semiconductor product and/or for the implementation of required/requested steps. Knowledge of related information, such as when a tool or tools will be undergoing some type of maintenance (e.g., preventive maintenance), is also desirable to obtain in conjunction with whether one or more tools are ready for producing a given semiconductor product.
Yet another problem with conventional schemes relates to conveying historical (and related) information specifically regarding one or more semiconductor products to specific tools within the semiconductor processing facility as the semiconductor product(s) travel to those tools for processing or inspection. While conventional schemes can convey process or inspection information about semiconductor product(s) to the host computer
104
(for use in any number of disparate ways), these schemes do not actually and automatically associate information about the semiconductor product with the semiconductor product as it travels through the semiconductor processing facility or make this information available to process and inspection tools. Consequently, what is needed is a scheme for associating historical (and related) information with a semiconductor product as it travels (and is processed) through a semiconductor processing facility.
Because of the deficiencies mentioned above, tools need to be shut down for maintenance more frequently than might otherwise be the case. Specifically, when a semiconductor product is processed by a tool, the resultant semiconductor product

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