Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2005-02-08
2005-02-08
Guerrero, Maria F. (Department: 2822)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
C438S778000, C438S784000, C438S787000
Reexamination Certificate
active
06852649
ABSTRACT:
A method of forming an essentially uniform doped insulating layer is disclosed. Variations in a substrate temperature that may result in a dopant gradient within a doped insulating layer can be compensated for by varying a dopant supply rate in a deposition process. One particular embodiment discloses a method of forming a high density plasma phosphosilicate glass having a phosphorous concentration of 8% or greater by weight that varies by no more than about 1% by weight throughout.
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Eisenmann, III Frederick G.
Fastow Michal
Phatak Prashant B.
Cypress Semiconductor Corporation
Guerrero Maria F.
Sako Bradley T.
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