Multi-stage interconnect architecture for complex...

Electronic digital logic circuitry – Multifunctional or programmable – Array

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C326S040000, C326S039000

Reexamination Certificate

active

06864713

ABSTRACT:
Systems and methods are disclosed for providing a multi-stage interconnect architecture, such as for high density and high performance complex programmable logic devices. As an example, a first stage of a two-stage interconnect architecture programmably routes signals from a global routing structure to a second stage of the two-stage interconnect architecture. The second stage routes signals from the first stage to a number of logic blocks. The second stage also-optionally routes feedback signals from the logic blocks along with signals from associated I/O terminals back to the logic blocks to provide local feedback capability.

REFERENCES:
patent: 5966027 (1999-10-01), Kapusta et al.
patent: 6100714 (2000-08-01), Xiao et al.
patent: 6184713 (2001-02-01), Agrawal et al.
patent: 6259273 (2001-07-01), Yin et al.
patent: 6348813 (2002-02-01), Agrawal et al.
ispMACH 5000VG Family, 3.3V In-System Programmable SuperBIG, SuperWIDE High Density PLDs Datasheet, Lattice Semiconductor Corporation, Dec. 2001.
ispXPLD 5000MX Family, 3.3V, 2.5V and 1.8V In-System Programmable eXpanded Programmable Logic Device XPLD Family Datasheet, Lattice Semiconductor Corporation, Mar. 2003.
U.S. patent application entitled “Programmable Logic Device With Enhanced Wide And Deep Logic Capability”, give Appl. No. 10/428,982, filed on May 1, 2003.
U.S. patent application entitled “CPLD with Multi-Function Blocks And distributed Memory”, given Appl. No. 10/428,889, filed on May 1, 2003.
U.S. patent application entitled “Cascaded Logic Block Architecture For Complex Programmable Logic Devices ”, given Appl. No. 10/428,885, filed on May 1, 2003.
ispMACH 4000V/B/C/Z Family Data Sheet, Lattice Semiconductor Corporation, 2003, pp. 1-82 Mar. 2003.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multi-stage interconnect architecture for complex... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-stage interconnect architecture for complex..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-stage interconnect architecture for complex... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3383003

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.