Multi-socket guide and test device comprising the same

Details Multi-socket guide and test device comprising the same Multi-socket guide and test device comprising the same

2009-09-11

2011-10-04

Nguyen, Khiem (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S268000

Reexamination Certificate

active

08029292

ABSTRACT:
A multi-socket guide for guiding a semiconductor package to a semiconductor package testing device includes a housing, a guiding unit disposed in the housing, the guiding unit guiding the housing to the semiconductor package testing device, and a mounting unit disposed in the housing, the mounting unit receiving the semiconductor package, wherein a size of the mounting unit corresponds to a size of a ball area of the semiconductor package.

REFERENCES:
patent: 6280219 (2001-08-01), Sano et al.
patent: 6863541 (2005-03-01), Kagami
patent: 7173442 (2007-02-01), Treibergs et al.
patent: 2006-138790 (2006-06-01), None
patent: 10-0510501 (2004-06-01), None
patent: 1020080005738 (2008-01-01), None

Affiliated with

Also associated with

Rating

Multi-socket guide and test device comprising the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-socket guide and test device comprising the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-socket guide and test device comprising the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4284168