Multi-segmented embossing apparatus and method

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – Reshaping running or indefinite-length work

Reexamination Certificate

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Details

C101S006000, C101S023000, C101S032000, C425S194000, C425S363000

Reexamination Certificate

active

06998086

ABSTRACT:
An embossing method and apparatus (20) comprises a rotary embossing device (32) having a radial direction (28) and an outer peripheral surface (34). The embossing device (32) includes at least one embossing-component (48) which extends at least radially outward from the peripheral surface (34), and is configured to provide for a first embossing-pattern (38). The embossing device (32) also includes a rotary shaft member (46). A base embossing-segment (50) is operatively joined to the rotary shaft member (46) and configured to carry a first base-section (40) of the first embossing-component (48). In a particular aspect, a first, supplemental embossing-segment (52) is operatively joined and selectively positionable on the rotary shaft member (46), and is configured to carry a first supplemental-section (42) of the first embossing-component (48). In other aspects, a first spacing mechanism (56) can adjust a radial position of the first, supplemental embossing-segment (52), and a first, supplemental attachment-mechanism (60) can secure the radial position of the second supplemental embossing-segment (52).

REFERENCES:
patent: 1357141 (1920-10-01), Bibb
patent: 3874836 (1975-04-01), Johnson et al.
patent: 3881490 (1975-05-01), Whitehead et al.
patent: 4159677 (1979-07-01), Smith
patent: 4289725 (1981-09-01), Muller et al.
patent: 5173313 (1992-12-01), Sato et al.
patent: 5211641 (1993-05-01), Roos et al.
patent: 5858515 (1999-01-01), Stokes et al.
patent: 5891118 (1999-04-01), Toyoshima et al.
patent: 5925026 (1999-07-01), Arteman et al.
patent: 6170393 (2001-01-01), Hook et al.
patent: 6251207 (2001-06-01), Schultz et al.
patent: 6716017 (2004-04-01), Papadopoulas
patent: 2001/0007065 (2001-07-01), Blanchard et al.
patent: 2002/0017354 (2002-02-01), Riddell
patent: 2002/0197346 (2002-12-01), Papadopoulos
patent: 2004/0176734 (2004-09-01), Rasmussen et al.
patent: 2005/0035492 (2005-02-01), Weiher et al.
patent: 2005/0064058 (2005-03-01), Lake et al.
patent: 1 321 286 (2003-06-01), None
patent: 2 370 780 (2002-07-01), None
patent: WO 90/05514 (1990-05-01), None
patent: WO 95/07674 (1995-03-01), None
patent: WO 97/20107 (1997-06-01), None
patent: WO 97/48551 (1997-12-01), None
patent: WO 98/51250 (1998-11-01), None

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