Multi-project wafer and method of making same

Details Multi-project wafer and method of making same Multi-project wafer and method of making same

2007-05-30

2010-12-14

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

Reexamination Certificate

active

07851272

ABSTRACT:
A semiconductor wafer is fabricated. The wafer has a plurality of dies. The plurality of dies include at least operable dies of a first type and operable dies of a second type different from the first type. The dies of the second type are rendered inoperable, while keeping the dies of the first type operable. The wafer is provided with the operable dies of the first type and the inoperable dies of the second type on it, for testing of the dies of the first type.

REFERENCES:
patent: 2005/0245005 (2005-11-01), Benson
patent: 2005/0280434 (2005-12-01), Whetsel
patent: 2006/0175697 (2006-08-01), Kurosawa et al.
patent: 2007/0241078 (2007-10-01), Pratt et al.
patent: 2008/0012098 (2008-01-01), Chow et al.
patent: 2008/0079125 (2008-04-01), Lu et al.

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