Multi-part lead frame with dissimilar materials and method of ma

Details Multi-part lead frame with dissimilar materials and method of ma Multi-part lead frame with dissimilar materials and method of ma

1996-10-25

2000-06-06

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257677, H01L 23495

Patent

active

060722282

ABSTRACT:
A multi-leadframe die assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi part lead frame assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi part lead frame may be dissimilar.

REFERENCES:
patent: 4984059 (1991-01-01), Kubota et al.
patent: 5014113 (1991-05-01), Casto
patent: 5227662 (1993-07-01), Ohno et al.
patent: 5336639 (1994-08-01), Nagaraj et al.
patent: 5339518 (1994-08-01), Tran et al.
patent: 5394607 (1995-03-01), Chiu et al.
patent: 5796162 (1998-08-01), Huang
patent: 5907769 (1999-05-01), Corisis

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