Multi-part electrode for a semiconductor processing plasma...

Details Multi-part electrode for a semiconductor processing plasma... Multi-part electrode for a semiconductor processing plasma...

2011-01-04

2011-01-04

Hassanzadeh, Parviz (Department: 1716)

Coating apparatus

Gas or vapor deposition

With treating means

C156S345430

Reexamination Certificate

active

07861667

ABSTRACT:
An improved upper electrode system has a multi-part electrode in which a central portion of the electrode having high wear is replaceable independent of an outer peripheral portion of the electrode. The upper electrode can be used in plasma processing systems for processing semiconductor substrates, such as by etching or CVD. The multi-part upper electrode system is particularly useful for large size wafer processing chambers, such as 300 mm wafer processing chambers for which monolithic electrodes are unavailable or costly.

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