Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-06-19
2007-06-19
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257SE25029
Reexamination Certificate
active
11165865
ABSTRACT:
A multi-mode integrated circuit structure. In one embodiment, an integrated circuit structure includes a first die having at least one first component disposed on a face, the first die fabricated using a first process that is optimal for operating the component in an first mode and a second die stacked on the first die, the second die having at least one second component disposed on a face and the second die fabricated using a second process separate from the first process that is optimal for operating the second component in a second mode. As such, the integrated circuit structure provides an electronic device with a single integrated circuit structure for performing operations optimally in more than one mode, such as operations in enhancement mode and operations in depletion mode.
REFERENCES:
patent: 4316203 (1982-02-01), Tohgei
patent: 4567575 (1986-01-01), Morihisa et al.
patent: 4701937 (1987-10-01), Wan et al.
patent: 5192920 (1993-03-01), Nelson et al.
patent: 5406096 (1995-04-01), Malhi
patent: 5793116 (1998-08-01), Rinne et al.
patent: 6097096 (2000-08-01), Gardner et al.
patent: 6288613 (2001-09-01), Bennett
patent: 6306686 (2001-10-01), Horton et al.
patent: 6373318 (2002-04-01), Dohnke et al.
patent: 6555917 (2003-04-01), Heo
Avago Technologies Wireless IP (Singapore) Pte. Ltd.
Dolan Jennifer M.
Jr. Carl Whitehead
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