Multi-mode integrated circuit structure

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...

Reexamination Certificate

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C257SE25029

Reexamination Certificate

active

11165865

ABSTRACT:
A multi-mode integrated circuit structure. In one embodiment, an integrated circuit structure includes a first die having at least one first component disposed on a face, the first die fabricated using a first process that is optimal for operating the component in an first mode and a second die stacked on the first die, the second die having at least one second component disposed on a face and the second die fabricated using a second process separate from the first process that is optimal for operating the second component in a second mode. As such, the integrated circuit structure provides an electronic device with a single integrated circuit structure for performing operations optimally in more than one mode, such as operations in enhancement mode and operations in depletion mode.

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