Multi-metal layer interconnect tape for tape automated bonding

Details Multi-metal layer interconnect tape for tape automated bonding Multi-metal layer interconnect tape for tape automated bonding

1990-01-09

1991-03-05

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29827, 156634, 156644, 156656, 1566591, 156901, 437220, B44C 122, C23F 102, C03C 1500, C03C 2506

Patent

active

049975170

ABSTRACT:
A multi-metal layer interconnect tape is provided. The tape is not supported by a dielectric carrier. A thin dielectric adhesive layer separates at least two self supporting metal foil layers. In one embodiment of the invention, conductive vias electrically interconnect leads formed in a first metal foil layer with ground and power circuits formed in a second metal foil layer. The metal foil layers are in close proximity so the vias have a low aspect ratio. The vias may be readily coated with continuous film of a conductive metal and are much easier to clean than conventional vias having significantly higher aspect ratios.

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"TAB Technology Tackles High Density Interconnections" from PC Technology (34/Electronic Packaging & Production (Dec. 1984).
"Tape-Automated Bonding Pushes in New Directions" from Electronics 10/3/87.
"Tab for High I/O and High Speed" from Semiconductor International -Jun. 1988.

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