Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2008-04-29
2008-04-29
Clark, S. V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S777000
Reexamination Certificate
active
07365416
ABSTRACT:
A semiconductor module is formed by alternately stacking resin boards3on which semiconductor chips2are mounted and sheet members having openings larger than the semiconductor chips2and bonded to the resin boards3. The resin board4located at the bottom out of the resin boards3is thicker than the other resin boards3.
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Fukuda Toshiyuki
Kawabata Takeshi
Nakatani Seiichi
Nobori Kazuhiro
Satou Motoaki
Clark S. V
Matsushita Electric - Industrial Co., Ltd.
McDermott Will & Emery LLP
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