Multi-level semiconductor module and method for fabricating...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

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C257S777000

Reexamination Certificate

active

07365416

ABSTRACT:
A semiconductor module is formed by alternately stacking resin boards3on which semiconductor chips2are mounted and sheet members having openings larger than the semiconductor chips2and bonded to the resin boards3. The resin board4located at the bottom out of the resin boards3is thicker than the other resin boards3.

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patent: 2004/0238935 (2004-12-01), Yoshimura
patent: 2005/0184377 (2005-08-01), Takeuchi et al.
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patent: 2007/0057358 (2007-03-01), Satou et al.
patent: 2002-064179 (2002-02-01), None
patent: 2003-218273 (2003-07-01), None

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