Multi-lead laser soldering apparatus

Details Multi-lead laser soldering apparatus Multi-lead laser soldering apparatus

1986-01-24

1987-07-21

Albritton, C. L.

Electric heating

Metal heating

By arc

219121LU, 219121LV, 219121LT, 372108, B23K 2600

Patent

active

046820019

ABSTRACT:
Apparatus for simultaneously soldering all the leads of a multi-lead SMP device to the pads of a substrate utilizes a gas laser having a cylindrical resonant cavity terminated at one end by a mirror that reflects energy back into the laser cavity. A plurality of beamlets corresponding to the number of leads of the SMP device are coupled out of the laser through holes in the mirror. All the beamlets have substantially the same amount of radiant energy. Each beamlet enters the near end of a different one of a corresponding number of elongate flexible optical wave guides extending away from the mirror toward an imaging lens. The far end of each optical wave guide is arranged so that its position can be moved. That enables the far ends of the wave guides to be arranged in different patterns to match the various patterns of leads of different SMP devices. The beamlets emerging from the far ends of the optical wave guides are focussed by the imaging lens on the joints to be soldered. The radiant energy of those beamlets is turned into heat and causes the solder at the joints to reflow so that all the soldered connections are made at the same time.

REFERENCES:
patent: 3315680 (1967-04-01), Silbertrust et al.
patent: 3408937 (1968-11-01), Lewis et al.
patent: 3467098 (1969-09-01), Ayres
patent: 3577094 (1971-05-01), Tomlinson et al.
patent: 4390994 (1983-06-01), Roberts et al.

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