Multi lead frame power package

Details Multi lead frame power package Multi lead frame power package

2009-10-05

2011-11-08

Chambliss, Alonzo (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S692000, C257SE23031, C257SE23051, C257SE23060, C361S710000, C361S813000, C438S122000, C438S123000

Reexamination Certificate

active

08053876

ABSTRACT:
According to an embodiment of the invention, a system, operable to facilitate dissipation of thermal energy, includes a mold compound, a die, a first lead frame, and a second lead frame. The die is disposed within the mold compound, and in operation generates thermal energy. The first lead frame is disposed at least partially within the mold compound and is operable to facilitate transmission of a signal. The second lead frame is disposed at least partially within the compound, at least partially separated from the first lead frame, and is operable to facilitate a dissipation of thermal energy.

REFERENCES:
patent: 5377077 (1994-12-01), Burns
patent: 5446313 (1995-08-01), Masuda et al.
patent: 5796162 (1998-08-01), Huang
patent: 5929513 (1999-07-01), Asano et al.
patent: 6025642 (2000-02-01), Burns
patent: 6049123 (2000-04-01), Burns
patent: 6087586 (2000-07-01), Chen
patent: 6184575 (2001-02-01), Chillara et al.

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