Multi-layered lead frame assembly for integrated circuits

Details Multi-layered lead frame assembly for integrated circuits Multi-layered lead frame assembly for integrated circuits

1994-01-14

1995-10-24

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Small lead frame for connecting a large lead frame to a...

257666, 257668, 257691, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

054612551

ABSTRACT:
There is provided a packaged semiconductor device having a multi-layered lead frame assembly (38). An integrated circuit chip (12) has an active face (16) with a plurality of bond pads (18) disposed along its center line (14). A first pair of insulating adhesive tape strips (20) adhere a main lead frame (22) to the active face (16) of chip (12). A second pair of insulating adhesive tape strips (28) adhere a respective pair of bus lead frames (30) to the main lead frame (24). Welds (36) electrically interconnect selective leads (22) of main lead frame (22) with respective leads (32) of bus lead frames (30). Tab bonds (40) or wire bonds (42) electrically interconnect selective leads (24) of main lead frame (22) with bond pads (18) on chip (12).

REFERENCES:
patent: 3967366 (1976-07-01), Birglechner et al.
patent: 4417266 (1983-11-01), Grabbe
patent: 4587548 (1986-05-01), Grabbe et al.
patent: 4796078 (1989-01-01), Phelps, Jr. et al.
patent: 4801999 (1989-01-01), Hayward et al.
patent: 4811081 (1989-03-01), Lyden
patent: 4891687 (1990-01-01), Mallik et al.
patent: 5070390 (1991-12-01), Shimizu
patent: 5146312 (1992-09-01), Lim
patent: 5206536 (1993-04-01), Lim
patent: 5252854 (1993-10-01), Aritaetali
Hybrid Assembly Time Reduced with Purpose-Designed Chips, Electronic Engineering, Jun. 1972, vol. 44, No. 532, pp. 57, 59-61 Jordan.

Affiliated with

Also associated with

Rating

Multi-layered lead frame assembly for integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-layered lead frame assembly for integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-layered lead frame assembly for integrated circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1888556