Multi-layered integrated circuit package with improved high freq

Details Multi-layered integrated circuit package with improved high freq Multi-layered integrated circuit package with improved high freq

1993-03-24

1994-08-16

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

257664, 257698, H01L 2504, H01L 2302, H01L 2312, H01L 2316

Patent

active

053389700

ABSTRACT:
A multi-layered package is disclosed that employs novel shielding techniques to improve high frequency performance of the package. Shield vias are placed near conductive vias to create a two-wire transmission line with controllable characteristic impedance. Controlled transmission line impedance reduces signal reflection due to line impedance variations and ground bounce due to inductive coupling. Opposite polarity shielding technique is introduced in vertical as well as horizontal directions to reduce capacitive coupling of noise between signals and provide immunity against differential power supply noise. Signal layers disposed half way between floating shield planes provided immunity against non-common mode noise coupling. For integrated circuits with varying types of signals (e.g. CMOS and TTL and ECL type signals), the package creates electrically isolated zones to drastically reduce noise coupling between the circuits with different signal types.

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