Multi-layered fluid soluble alignment bars

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With means for controlling lead tension

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257666, H01L 2350, H01L 2354

Patent

active

051775913

ABSTRACT:
A lead frame interconnection assembly and method of fabricating the assembly having multi-layered alignment bars. First and third layers of the alignment bars are strips of water soluble tape attached at opposite sides of the conductive fingers. The strips of tape are perpendicular to the conductive fingers and parallel to each other. The strips of tape sandwich a center layer that is made of a flowable, water soluble material. Preferably, the alignment bar acts as a dam bar to stop the flow of encapsulant material during the formation of a package. After the alignment bar has served the intended function, the bar may be dissolved without adversely affecting the structural integrity of the conductive fingers.

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