Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With means for controlling lead tension
Patent
1991-08-20
1993-01-05
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With means for controlling lead tension
257666, H01L 2350, H01L 2354
Patent
active
051775913
ABSTRACT:
A lead frame interconnection assembly and method of fabricating the assembly having multi-layered alignment bars. First and third layers of the alignment bars are strips of water soluble tape attached at opposite sides of the conductive fingers. The strips of tape are perpendicular to the conductive fingers and parallel to each other. The strips of tape sandwich a center layer that is made of a flowable, water soluble material. Preferably, the alignment bar acts as a dam bar to stop the flow of encapsulant material during the formation of a package. After the alignment bar has served the intended function, the bar may be dissolved without adversely affecting the structural integrity of the conductive fingers.
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Clark S. V.
Hille Rolf
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