Multi-layer superconducting circuit substrate and process for ma

Details Multi-layer superconducting circuit substrate and process for ma Multi-layer superconducting circuit substrate and process for ma

1988-04-27

1990-09-04

Ryan, Patrick

Superconductor technology: apparatus, material, process

High temperature , per se

Having tc greater than or equal to 150 k

505701, 505702, 505703, 505704, 428 68, 428 76, 428209, 428210, 428426, 428432, 428433, 428688, 428901, 428930, B32B 300

Patent

active

049544802

ABSTRACT:
A multi-layer superconducting circuit substrate, including insulating layers, and interconnection patterns of a superconductive ceramic material located between the insulating layers, the patterns of the superconductive ceramic material being connected via through-holes of the superconductive ceramic material, is provided. The patterns of the superconductive ceramic material are preferably encapsulated with a metal of gold, silver, platinum or an alloy thereof.

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IBM Technical Disclosure Bulletin, vol. 21, No. 10, Mar. 1979, pp. 4213, 4214, Connectors for Cryogenic Circuits, F. Fang and B. P. Piggin.
Copy of European Search Report.
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