Multi-layer printed circuit board

Details Multi-layer printed circuit board Multi-layer printed circuit board

2007-07-03

2007-07-03

Andujar, Leonardo (Department: 2826)

Coopering

Crozing staves

Rotary cutter

C174S250000, C257S700000, C257S691000, C361S748000

Reexamination Certificate

active

11244333

ABSTRACT:
A multi-layer PCB includes a first signal layer, a ground layer, a second signal layer, a third signal layer, an electric power layer, and a fourth signal layer, including a first insulating layer arranged between the first signal layer and the ground layer; a second insulating layer arranged between the ground layer and the second signal layer; a third insulating layer arranged between the second signal layer and the third signal layer; a fourth insulating layer arranged between the third signal layer and the electric power layer; and a fifth insulating layer arranged between the electric power layer and the fourth signal layer, wherein at least one of the first signal layer, the second signal layer, the third signal layer, and the fourth signal layer includes a pattern.

REFERENCES:
patent: 5946557 (1999-08-01), Hosoda et al.
patent: 6172305 (2001-01-01), Tanahashi
patent: 6326557 (2001-12-01), Cheng
patent: 6384340 (2002-05-01), Cheng
patent: 1994-06-177548 (1994-06-01), None
patent: 2002-299815 (2002-10-01), None

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