Multi-layer polishing pad

Details Multi-layer polishing pad Multi-layer polishing pad

2004-10-01

2010-02-02

Eley, Timothy V (Department: 3724)

Abrading

Machine

Rotary tool

C451S290000, C451S527000, C451S533000, C451S540000

Reexamination Certificate

active

07654885

ABSTRACT:
A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing surface, a first thickness, a first compressibility, and a hardness between about 40 to 80 Shore D. The backing layer has a second thickness greater than the first thickness and a second compressibility greater than the first compressibility. The first thickness, first compressibility, second thickness and second compressibility are such that the polishing surface deflects at least 2 mil under an applied pressure of 1 psi or less.

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