Multi-layer photoresist air bridge fabrication method

Details Multi-layer photoresist air bridge fabrication method Multi-layer photoresist air bridge fabrication method

1990-12-17

1993-06-15

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430313, 430315, 437229, 437231, G03C 558

Patent

active

052197131

ABSTRACT:
The method of constructing an air bridge on a substrate between spaced apart conductors on the substrate with the bridge spanning the distance between the conductors, by using PMGI to build a bridge pad on the substrate; using PMMA to build a bridge pattern over the pad with the ends of said conductors extending into said pattern; depositing titanium and gold over said pad within said pattern by directing the titanium and gold into said pattern onto said pad and conductor ends using relative motion between the substrate and the titanium and gold; and removing the PMGI and PMMA.

REFERENCES:
patent: 3331125 (1967-07-01), McCusker
patent: 3932226 (1976-01-01), Klatskin et al.
patent: 4289846 (1981-09-01), Parks et al.
patent: 4601915 (1986-07-01), Allen et al.
patent: 4642259 (1987-02-01), Vetanen et al.

Affiliated with

Also associated with

Rating

Multi-layer photoresist air bridge fabrication method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-layer photoresist air bridge fabrication method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-layer photoresist air bridge fabrication method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1041771