Multi-layer lead frame using a metal-core substrate

Details Multi-layer lead frame using a metal-core substrate Multi-layer lead frame using a metal-core substrate

1993-10-22

1995-02-14

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257691, 257672, 257676, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

053898168

ABSTRACT:
A metal-core-type multi-layer lead frame adapted to be used for a semiconductor device includes a metal core plate on which a semiconductor chip is to be mounted. A plurality of signal lines are formed on the metal core plate. A metal plane, such as a power supply plane or a ground plane, is laminated on the signal lines, through an insulating layer, so that an outer peripheral edge of said metal core plate is uncovered to expose the outer portion of the respective signal lines. A lead frame body has a plurality of leads which are electrically connected to the respective signal lines at the outer peripheral edge of the metal core plate.

REFERENCES:
patent: 4891687 (1990-01-01), Mallik et al.
patent: 5089878 (1992-02-01), Lee
patent: 5196725 (1993-03-01), Mita et al.
patent: 5214845 (1993-06-01), King et al.
patent: 5220195 (1993-06-01), McShane et al.
patent: 5237202 (1993-08-01), Shimizu et al.
Patent Abstracts of Japan, vol. 017, No. 375 (E-1397) 14 Jul. 1993 & JP-A-05 063 130 (Sumitomo Special Metals Co Ltd) 12 Mar. 1993.
Patent Abstracts of Japan, vol. 016, No. 200 (E-1201) 13 May 1992 & JP-A-04 030 541 (Shinko Electric Ind Co Ltd) 3 Feb. 1992.
Patent Abstracts of Japan, vol. 015, No. 326 (E-1102) 20 Aug. 1991 & JP-A-03 123 067 (Shinko Electric Ind Co Ltd) 24 May 1991.
Patent Abstracts of Japan, vol. 016, No. 513 (E-1283) 22 Oct. 1992 & JP-A-04 192 452 (Sumitomo Metal Mining Co Ltd) 10 Jul. 1992.

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