Probe structure for testing a semiconductor chip and a press mem

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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324757, G01R 104

Patent

active

054282985

ABSTRACT:
A tester applicable to semiconduction chips having a plurality of pins. The tester comprises a TAB tape having an adhesive surface and a plurality of connecting wires attached to the adhesive surface of the TAB tape and connected to a test card. At a probe region of the tester, probe tips are disposed which come into contact with pads of the semiconductor chip to be tested, upon testing. Each probe tip is made of a palladium layer having a serrated edge grown to shape over a nickel film on a portion of each connecting wire, which portion is disposed at the probe region. The tester can test a semiconductor chip having a plurality of pins and carry out simultaneous probings of a semiconductor chip having the number of pins enabling a TAB chip bonding. Both a functional test and a burn-in test may be carried out with a single test system. Since the tester has many sharp probe tips made of dendritic-grown palladium, it can provide an improvement in proving effect. The sharp probe chips also eliminate a non-contact problem.

REFERENCES:
patent: 4443755 (1984-04-01), Wooten
patent: 4785137 (1988-11-01), Samuels
patent: 4804132 (1989-02-01), DiFrancesco
patent: 5008614 (1991-04-01), Shreeve et al.
patent: 5010246 (1991-04-01), Nishikawa
patent: 5196785 (1993-03-01), Douglas

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