Multi-layer lead-frame for a semiconductor device

Details Multi-layer lead-frame for a semiconductor device Multi-layer lead-frame for a semiconductor device

1995-05-04

1996-11-19

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Small lead frame for connecting a large lead frame to a...

257676, 257677, H01L 23495

Patent

active

055765777

ABSTRACT:
A multi-layer lead-frame for a semiconductor device includes a signal layer made of a metal strip having a signal pattern including a plurality of lead lines. A power supply layer is adhered and laminated to the signal layer and a ground layer is adhered and laminated to the power supply layer. A ceramic plate made of a ferroelectric substance is disposed between the power supply and ground layers. Conductive adhesive material is disposed between said ceramic plate and said first metal layer, and between and adhering to said ceramic plate and said second metal layer.

REFERENCES:
patent: 3617817 (1971-11-01), Kawakatsu
patent: 5089878 (1992-02-01), Lee
patent: 5237202 (1993-08-01), Shimizu et al.
patent: 5311057 (1994-05-01), McShane
Seyed Hassan Hashemi et al., "The Close Attached Capacitor: A Solution to Switching Noise Problems" IEEE Transactions of Components, Hybrids, and Manufacturing Technology, vol. 15, No. 6, Dec. 1992.

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