Multi-layer flexible film module

Details Multi-layer flexible film module Multi-layer flexible film module

1984-04-13

1985-05-14

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156652, 156655, 1566591, 156668, C23F 102, B44C 122, C03C 1500, B29C 1708

Patent

active

045170517

ABSTRACT:
A high density electronic circuit module which includes a thin flexible film chip carrier having circuitry on both sides thereof. The double-sided thin, flexible circuitry is fabricated by depositing a first layer of chrome-copper-chrome circuitry on an aluminum substrate. This first layer of chrone-copper-chrome circuitry is covered with a layer of polyimide. Vias are etched into the polyimide. Next, a second layer of chrome-copper-chrome circuitry is deposited on top of the polyimide. The first and second layers of circuitry are connected through the etched vias. Finally, hydrochloric acid is utilized to etch away the aluminum substrate carrier. It is noted that hydrochloric acid etches aluminum whereas it does not etch chrome-copper-chrome circuitry.

REFERENCES:
patent: 3823467 (1974-07-01), Shamash et al.
patent: 4243474 (1981-01-01), Shirai et al.
patent: 4306925 (1981-12-01), Lebow et al.
patent: 4420364 (1983-12-01), Nukii et al.

Affiliated with

Also associated with

Rating

Multi-layer flexible film module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-layer flexible film module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-layer flexible film module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-767243