Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Patent
1994-11-15
1997-02-04
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
257753, 257777, 257779, 257691, H01L 2302, H01L 2352, H01L 2348
Patent
active
056001835
ABSTRACT:
An integrated circuit chip bonding system comprising a multi-layer film adhesive for mounting an integrated circuit chip to a printed circuit substrate having a metallized grounding pad disposed thereon that is connected to a circuit ground of the integrated circuit chip. The multi-layer film adhesive comprises a lower film layer that is a dielectric insulator, and an upper film layer that is disposed in contact with the chip. The length and width dimensions of the upper film layer are slightly larger than the dimensions of the integrated circuit chip, and the dimensions of the lower film layer are slightly larger than the dimensions of the upper film layer. Conductive adhesive is used to electrically connect the upper film layer to the circuit ground by way of the metallized pad.
REFERENCES:
patent: 5175397 (1992-12-01), Lindberg
patent: 5262674 (1993-11-01), Banerji et al.
patent: 5311057 (1994-05-01), McShane
patent: 5313365 (1994-05-01), Pennisi et al.
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5381047 (1995-01-01), Kanno
Alkov Leonard A.
Crane Sara W.
Denson-Low Wanda K.
Hughes Electronics
Williams Alexander Oscar
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